Title of the project: “Development of Ultra-soft Chemical Mechanical Planarization (USCMP) Technology for CZT and MCT Polishing”
Essential: M. Tech. in Materials Engineering/Material Science/Nanotechnology, Chemical Engineering or M.Sc. with NET in Materials Science, Physics or Chemistry or B.E/B. Tech. with GATE in Materials Science/Engineering/ Ceramic Engineering/Technology, Chemical Engineering
Desirable: Research experience in nanoparticle synthesis and characterization, surface characterizations and polishing of semiconductor wafers.
Age: Below 30 yrs
Stipend : Rs.28000